Dr. Anya Sharma
- -2025-06-29
For 50 years, Moore's Law—the doubling of transistors on a chip every two years—has driven the digital revolution. Now, as we hit the physical limits of silicon, its end is being declared. This blog explains why traditional scaling is over and explores the innovative new techniques, like 3D stacking and chiplets, that will continue to drive computing performance forward.
Moore's Law was an economic observation about scaling, but it relied on the physical ability to shrink transistors. We are now approaching the atomic scale, where quantum effects like electron tunneling make further shrinking prohibitively difficult and expensive. It's no longer economically or physically feasible to simply cram more transistors onto a single piece of silicon in the same way we used to.
The end of simple scaling has forced the industry to innovate. The new mantra is "More than Moore." Instead of one giant, monolithic chip, designers are now creating systems using "chiplets"—smaller, specialized chips that are combined in a single package. Another key innovation is 3D stacking, where layers of chips or memory are stacked vertically. These advanced packaging techniques allow for continued increases in performance and efficiency, ensuring the spirit of Moore's Law lives on.
The voracious computational demands of AI and other modern workloads have pushed general-purpose CPUs to their limits. This has ushered in a golden age of specialized silicon, with custom-designed chips like GPUs, TPUs, and ASICs delivering massive performance gains for specific tasks.
For 50 years, Moore's Law—the doubling of transistors on a chip every two years—has driven the digital revolution. Now, as we hit the physical limits of silicon, its end is being declared. This blog explains why traditional scaling is over and explores the innovative new techniques, like 3D stacking and chiplets, that will continue to drive computing performance forward.
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